Plating Solder Ball
ProductFeatures ：
Purity reaches sn99.95+, low melting point andmelt fast. The impurity is suitable for the current electroplating process according to SPEC JISZ 3282 and GB/T3131-2001
Product Use ：
IC Assembly & PCB Plating Process
Product Spec ：
φ13mm--φ25mm Half Ball & Ball
Alloy Composition：Sn99.95+
